Powering the Power Electronics Industry
The continuous drive toward decarbonization is fueling power semiconductor innovations—whether in terms of materials, chip design, circuit topologies, or packaging. The need to improve and enhance energy efficiency, one of the most demanding challenges of power electronics, to meet the requirements imposed by international standards and to reduce power waste, is expected to lead to more sustainable electronics products and systems.

PowerUP Asia is a two-day virtual conference and exhibition highlighting the latest technology developments and trends in power electronics, including wide-bandgap (WBG) devices, power semiconductors, and related technologies, as manufacturers worldwide set their sights on power efficiency, carbon reduction, and greener energy. PowerUP Asia 2024 will bring the latest developments in power semiconductor and engineering, and how the industry can explore ways to accelerate the pathway to net-zero carbon emissions.

Day 1: GaN and SiC Semiconductors
Adoption of wide band gap (WBG) components—specifically gallium nitride (GaN) and silicon carbide (SiC)—continues to gain traction as manufacturers focus on decarbonization and sustainability. WBG devices are providing new solutions and answers to the challenges that power device designers face in an era in which the watchword is“ efficiency.”
Day 1 will focus on GaN and SiC semiconductors and their applications in power electronics.

Day 2: Power Semiconductors in Low- and High-Power Applications
The increasing demand for high voltage devices in high-power applications is driving developments in power IC technologies. Meanwhile, battery powered devices continue to demand components that consume as low power as possible to ensure longer operations.
Day 2 will focus on power conversion and managing design trends in low- and high-power applications.