India Electronics and Semiconductor Association (IESA) - MSIA unresponsive

Dr. V. Veerappan

Chairperson, IESA; Co-founder, Tessolve

Silicon Labs

Manish Kothari

Senior Vice President, Software Development

• State of the IoT: Massive Market Opportunity
• The Symbiotic Relationship Between AI and IoT
• The Role of Data in AI and IoT
• Data Challenges and Opportunities
• Conclusion

MosChip® Technologies

Vishal Patil

Senior Vice President - Product Engineering Services BU

The convergence of IoT and AI is transforming digital enterprises, creating a seamless bridge between machines and humans. By enhancing human-machine interaction, increasing operational efficiency, and enabling personalized experiences, these technologies are driving the evolution of connected digital enterprises. The presentation will talk more about how the combined power of IoT and AI is uniting the all three - digital enterprises, machines, and humans.

Arm

Blade Lin

Staff FAE, Arm

• AI evolution for IoT
• Edge AI Transformation
• Intelligent Endpoints
• Future of AI

Texas Instruments

Robert Tolbert

Product marketing engineer

Explore the evolution of smart devices from basic internet-connected components to advanced systems capable of intelligent, context-aware interactions. This webinar delves into the role of intelligent sensing in this transformation, focusing on mmWave radar technology. Learn how this technology enhances device intelligence, allowing for more reliable and nuanced interactions with the environment, enhanced privacy, and better user experiences.

We'll examine the technical challenges and solutions in reducing false positive detections in radar technology, specifically addressing issues caused by environmental changes, non-human movement, and other potential interferences. The session concludes with a practical demonstration and a Q&A, providing a comprehensive understanding of mmWave radar's impact on smart device development.

Telink Semiconductor

Eric Liang

Business Development Director

Telink Semiconductor will showcase its innovations in high-performance low-power wireless IoT SoC chips in this presentation. As the world's leading supplier of IoT chips, Telink Semiconductor not only provides diversified products such as multi-protocol IoT chips, 2.4GHz proprietary chips, and wireless audio chips but also introduces a series of cutting-edge application solutions, including ultra-low latency wireless gaming, High-Accuracy Wireless Ranging, Matter, Bluetooth LE Audio, Bluetooth Mesh 1.1, 1-to-M Network - Bluetooth@ PAwR and ESL technology in depth. We invite you to join us for a webinar to learn more about these solutions and how they can empower your projects.

Soitec

Travis Heng

Senior Marketing Manager

As the demand of Edge AI continues to grow and evolve, the need for high performance Edge devices to support such Edge AI applications is increasing.
These devices are required to achieve real-time, low-latency with always-on feature and analog/RF and memory integration. The technology that they adopt will determine how they fulfill or exceed such expectations.
In his presentation, Travis will illustrate the benefits of engineered substrates to deliver these requirements in Edge AI applications.

STMicroelectronics

Matteo MARAVITA

Head of Asia Pacific AI Competence Center, Senior Manager, STMicroelectronics

In this session Matteo Maravita is going to introduce how STMicroelectronics is supporting Solutions for EdgeAI. It will be a comprehensive overview of both HW solutions (Sensors, Microcontrollers and Microprocessors) and SW ecosystem (AI libraries, Tools and Model zoo) from STMicroelectronics dedicated to AI, together with few real use case examples developed in partnership with key customers.

Infineon Technologies AG

Eric Seow

Director, Application Marketing, Smart Home and Building

"IoT, consumer and industrial applications or the automotive sector: None of these areas would work as reliably, seamlessly, and intuitively if it was not for Edge AI. So, how must products and solutions look like to bring AI to the edge and to make use of all advantages that come along with having artificial intelligence on a chip? Find out more about PSOC™️ Edge, Infineon’s Machine Learning-enhanced sensing, low power, secured, and advanced HMI high-performance microcontroller family and enables designers to deliver unmatched, highly usable end-user experiences for next generation devices. "

India Electronics and Semiconductor Association (IESA)

Ashok Chandak

President : IESA

Bluetooth SIG

Lori Lee

Senior Director, APAC & China, Bluetooth SIG

The Bluetooth® Channel Sounding technology, released by Bluetooth SIG in September, introduces a new secure, fine-ranging feature that enhances the accuracy and safety of Bluetooth devices by enabling precise distance awareness.
Channel Sounding expands the existing set of Bluetooth® device positioning features that enable one device to determine the presence, distance, and direction of another. In this presentation, Lori Lee, Director of Marketing for APAC & China at Bluetooth SIG, will provide an overview of the Bluetooth device positioning features, introduce Channel Sounding, and discuss how the Channel Sounding feature benefits key use cases.

Siemens DISW

Michael Munsey

Vice President Semiconductor Industry, Siemens DISW

For years, vehicle design was done much the same way, with the decomposition of requirements into specific car systems. Even as software began to become more prevalent, the software enabled vehicle still followed this methodology. Today, software defines the user experience of the car, and we now find ourselves in the era of the software defined, silicon enabled vehicle. This change is disrupting how we think about vehicle design and turning the design process on its head. We now must rethink how we design and develop vehicles to support this new paradigm.

Tektronix

Tan Chuan-Shin

Regional Marketing Manager, Tektronix

This presentation discusses the life cycle of a power semiconductor device and the tremendous variety of test and characterization activities, and measurement challenges faced by the engineers involved in each stage throughout the cycle. From the early stages of designing a new power device to the point where it’s ready for market, a flexible set of high-power characterization tools are essential for testing across the entire life cycle of power semiconductor devices.

Winbond Electronics Coporation

Jun Kawaguchi

Winbond Security Marketing Executive

This topic focuses on how cybersecurity measures are essential in the development and operation of modern vehicles, particularly with the rise of autonomous and connected cars. And how Winbond W77Q/W77T protect vehicles from cyber threats. The session will include: 1. Critical Connectivity and Vulnerabilities: Modern cars use numerous computerized modules and network connectivity for various functions, increasing cyber threats. Also, the risks from unauthorized remote access can impact on vehicle systems 2. W77Q/W77T: Explains how Winbond’s secure Flash devices, with certifications like CC EAL5+ and ISO21434, protect against attacks and support secure OTA updates.

Texas Instruments

Alex Grudzinski

Product Marketing Engineer

The growing adoption of electric and hybrid vehicles has spurred demand for compact, cost-effective embedded controllers that prioritize safety and reliability. TI is continuously expanding its Arm Cortex-M0+ AEC-Q100 microcontroller portfolio with varying levels of analog integration, safety mechanisms, and communication interfaces for automotive applications. Learn how the MSPM0 AEC-Q100 microcontrollers and associated development resources can speed up your automotive design and qualification process.

STMicroelectronics

Kwang Meng KOH

Marketing Manager, STMicroelectronics

Matter is an open-source, royalty-free connectivity standard designed to improve interoperability between smart home devices and platforms. It is developed by the Connectivity Standards Alliance (CSA), formerly known as the Zigbee Alliance.

Key Features of Matter 1. Interoperability: • Universal Compatibility: Devices from different manufacturers can work together seamlessly. • Cross-Platform Support: Compatible with major smart home ecosystems like Apple HomeKit, Google Home, Amazon Alexa, and others.

2. Security: • End-to-End Encryption: Ensures secure communication between devices. • Regular Updates: Continuous improvements and security patches.

3. Simplicity: • Easy Setup: Simplified onboarding process for new devices. • User-Friendly: Designed to be intuitive for consumers.

4. Reliability: • Robust Performance: Enhanced reliability in device communication. • Local Control: Devices can operate without relying on cloud services, reducing latency and enhancing privacy.

Matter aims to simplify the smart home landscape by providing a unified, secure, and reliable standard for device interoperability. Whether you are a consumer looking to enhance your smart home or a manufacturer aiming to develop compatible products, Matter offers a promising solution to the complexities of smart home integration.