Stephen Las Marias, Editor of EE Times Asia/India, EDN Asia

Welcome and Opening

Cadence Design Systems, Inc., Dr. Vinod Kariat, PhD, Corporate VP, Research and Development, Custom IC Group, Cadence,

Analog and custom design are traditionally manual and labor intensive. Increasing analog design productivity is a critical need for all semiconductor companies. In this talk, we will explore how analog design is being transformed by the application of current generative AI techniques. We also will briefly look at longer term opportunities for the application of newly emerging AI technologies.

Synopsys, Dr. Thomas Andersen, Vice President, AI and Machine Learning, Synopsys,

Artificial Intelligence is an avenue to innovation that is touching every industry worldwide. AI has made rapid advances in areas like speech and image recognition, gaming, and even self-driving cars, essentially automating less complex human tasks. In turn, this demand drives rapid growth across the semiconductor industry with new chip architectures emerging to deliver the specialized processing needed for the huge breadth of AI applications. Given the advances made to automate simple human tasks, can AI solve more complex tasks such as designing computer chips? In this talk, we will discuss the challenges and opportunities of building advanced chip designs with the help of artificial intelligence, enabling higher performance, faster time to market and improved productivity.

Texas Instruments Inc., Vaibhav Mahimkar, Edge AI Software Product Manager,

˙ Sharing TI’s insights into embedded system market trends and the increasing demand for more integration and intelligence of modern electronics.

˙ Highlight the breakthrough and advantage of TI vision processors and how TI help to solve the major challenges for designers and enable next-generation embedded systems.

˙ Recap TI’s vision and core value and commitment to the market/customers in the end.

MosChip Technologies Ltd, Nagi Reddy Chitta, AVP - Embedded Software, MosChip,

The rapid advancement of artificial intelligence (AI) has revolutionized various industries, including medical, automotive, and security sectors. However, this technological progress is not without challenges. Ethical concerns, data privacy, and bias in AI algorithms demand careful attention to ensure responsible AI adoption. Policymakers, industry leaders, and researchers must collaborate to address these issues and establish robust regulatory frameworks to govern AI implementations effectively. This talk will discuss how we can harness the full potential of this transformative technology and shape a brighter and more interconnected future.

Tektronix, Chuan-Shin Tan, Regional Marketing Manager, Taiwan & ASEAN, Tektronix

What's driving the next wave in the world of electronics? What challenges are ahead of us? How test & measurement enable us?



THE ORGANIZER RESERVES THE RIGHT TO MAKE CHANGES TO THE SCHEDULE OF PRESENTATIONS, FOR ANY REASON, AT ANY TIME, WITHOUT ANY PRIOR NOTICE, AND WITHOUT ANY LIABILITY.

Stephen Las Marias, Editor of EE Times Asia/India, EDN Asia

Welcome and Opening

Merck, Dr. Safa Kutup Kurt, Head of Operations of Digital Solutions, The Electronics business of Merck

The semiconductor industry is thriving with advanced innovations and pushing the boundaries of chip manufacturing. In this keynote, Dr. Safa Kutup Kurt, will insights on how automation and digitization can improve process efficiency, reduce costs, and provide innovative solutions, by scaling digitalization for operational success, supply chain resilience, and predictive optimization. He will also explain how generative AI brings new opportunities, bolstering manufacturing intelligence. As a global leading material provider, Merck is looking forward to forming collaborative partnerships with device makers, by combining data analytics and expertise, tackle complex quality control issues. The goal is to enable the industry to drive growth and innovation and growth through data sharing and analytics.

Navitas Semiconductor, Stephen Oliver, VP Corporate Marketing & Investor Relations

GaN and SiC are revolutionary, wide bandgap technologies, enabling higher efficiency, higher power density, higher reliability and with lower system cost than legacy silicon. For applications, this means long range, fast charging, lower CO2 footprint, and accelerating the conversion from fossil fuels to renewable energy and electrified loads.

NXP Semiconductors, Christian Castel, Industrial Automation Marketing - Global Lead, Edge Processing Business Line, NXP Semiconductors

Manufacturers worldwide are already leveraging industrial IoT (IIoT) technologies to radically improve operations, streamline production and optimize manufacturability. Instead of tearing down existing factories and rebuilding from scratch, manufacturers are adding more efficient equipment, advanced robotics and faster networks. Communication gaps between legacy protocols like PROFINET make it a challenge for these new technologies to work harmoniously with existing systems. Time-sensitive data needs to transmit in real-time across the network. This fully synchronized operation requires technologies that support a complex mix of protocols and provide backward compatibility.

To achieve this, a combination of optimized processing power, low power consumption, hardware security and flexible architectures with time-sensitive network traffic capabilities are required. NXP has expanded our crossover MCU portfolio to address this growing industrial application need. The newly announced i.MX RT1180 crossover MCU, the first with an integrated Gb time-sensitive networking (TSN) switch, supports real-time communications and multiple communications protocols, bridging the gap between existing industrial systems and Industry 4.0 platforms. The i.MX RT1180 is also the first NXP crossover MCU to include an EdgeLock® secure enclave, a preconfigured, self-managed and autonomous on-die security subsystem that eases the complexity of implementing robust, system-wide security intelligence for industrial IoT and smart manufacturing.

Applied Materials, Inc., Suraj Rengarajan, Managing Director & India CTO, Applied Materials India PVT. LTD.

Harnessing the power of robotics, AI, data analytics, & automation has elevated efficiency, quality, and scalability to unprecedented levels across industries. Integration of automation and semiconductor production improvements is expected to drive innovation & shape the future of smart manufacturing across semiconductor, pharma, and auto.

Synopsys, Mr. Gabriel Villareal, Director of Applications Engineering for Smart Manufacturing, Synopsys

Motivation

Production control has become increasingly complex due to the need of having advanced processes to meet the requirements of today’s chip. Driving this complexity in the background are the requirements of… 1. Having a nimble and scalable sandbox to collate data lakes of different shape and sizes per use case and over time. 2. Having adaptable analytics to find the hidden insights buried deep in a single data lake or across multiple data lakes. Short of not having a solution in place to address these requirements, engineer and equipment productivity are bound to be adversely impacted.

Approach

A fab is a tightly ran ecosystem that requires many independent point solutions to optimally run simultaneously with petabytes of knowledge generated on a yearly basis. Opening the gate to enable seamless sharing of knowledge back and forth can unlock productivity bottlenecks and uncover new value. Ideally migrating to an all-inclusive solution would solve the problem but the practicality of such a paramount effort is not a risk a fab would be willing to undertake. Alternatively, adding synergetic layers around the current ecosystem to enable the orchestration and contextual mapping of data will offer better flexibility and less risk. To further take advantage of this synergy highway, AI/ML models honed specifically for smart manufacturing can autonomously explore correlations with or without the guidance of the subject matter expert. Looking beyond the horizon to extend these synergy highways to upstream knowledge, design and development phases, and downstream knowledge, test and in-field, will bring unprecedented optimization capabilities.

Summary

Highly scalable and reliable platform which is powered by many AI/ML applications can address the current and anticipated process control challenges of semiconductor fabs. At the core of process control applications exist AI/ML based digital models (digital twins of fab equipment) which powers the accuracy requirements of the latest generation fab’s process control. Knowledge continuum from design to manufacturing to test provides strong solutions which ingest data from entire fab manufacturing line to drive efficiency in high volume manufacturing.

Texas Instruments Inc., Felicity Gonzalez, Product Market Engineer (TI),

In recent years, many historically stand-alone devices have begun incorporating Wi-Fi: utility grids, homes and buildings, electric vehicles, appliances, medical devices, etc. This means it is more important than ever for engineers and designers to understand Wi-Fi. In this presentation we will discuss the evolution of Wi-Fi, the latest Wi-Fi standards (802.11ax aka Wi-Fi 6), common Wi-Fi architectures used, and typical IoT end node Wi-Fi use cases.



THE ORGANIZER RESERVES THE RIGHT TO MAKE CHANGES TO THE SCHEDULE OF PRESENTATIONS, FOR ANY REASON, AT ANY TIME, WITHOUT ANY PRIOR NOTICE, AND WITHOUT ANY LIABILITY.

Stephen Las Marias, Editor of EE Times Asia/India, EDN Asia

Welcome and Opening

GaN Systems, Stephen Coates, General Manager (Asia) and VP Operation,

The electric vehicle (EV) is widely considered a powerful tool in reducing global CO2 emissions from the transport sector. Driven by strong regulations, fiscal incentives, and investment in infrastructure, the world has witnessed a robust surge in EV adoption. Global sales of EVs surpassed 10 million for the first time in 2022, accounting for 14% of total new vehicle sales. The EV fleet on the road is avoiding a whopping 150 million metric tonnes of CO2 emissions per year; however, there is still a large gap to reach net zero emissions.

For mainstream EVs, GaN power semiconductors play a pivotal role in realizing the design of compact, lightweight, and significantly more efficient powertrains demanded by the next generation of high-performance EVs.

This talk will share how GaN offers system-level breakthroughs in power density and efficiency in key EV applications, including On-Board Chargers, DCDC Converters, and Traction Inverters.

Arm, Jason Lee, Senior Automotive Marketing Manager APAC, Arm

The number of screens in cars will increase dramatically over the next few years, the original EE architecture is no longer sufficient to accommodate more screens without increasing costs whether in SoC or cables. Arm is developing new technologies through the display zonal architecture to improve the reliability, flexibility, and performance of automotive systems.

Bluetooth Special Interest Group (SIG), Lori Lee, Director, Marketing, APAC & China,

Bluetooth is a wireless standard with a global reach that has seen continued growth despite the challenges of the global pandemic. From audio streaming and data transfer to location services and device networks, Bluetooth continues to prioritize market needs and innovate to meet growing user demands. The Bluetooth SIG is committed to enhancing Bluetooth technology's overall performance, as demonstrated by the launch of Auracast™ broadcast audio and the completion of the LE Audio specification. Auracast™ broadcast audio, to deliver life-changing audio experiences, will also be introduced. With the introduction of Auracast™ broadcast audio, Bluetooth technology will be installed in public locations, allowing people to interact with audio in various public venues and environments like never before. As we look to the future, Bluetooth technology will undoubtedly continue to evolve and innovate to meet the ever-changing needs of users.

Molex, Clark Chou, Senior Director of Sales for Automotive and Datacom Business,

The automotive industry is experiencing a turning point in electrification, autonomous driving, and zonal architecture. In this keynote, Clark Chou, Molex Senior Director of Sales for Automotive and Datacom Business, will share insights on trends driving the transportation market growth and how Molex leverages its experience from decades of work across industries to provide reliable and uncomplicated interconnect solutions for tomorrow.

proteanTecs, Gal Carmel, EVP, GM Automotive, proteanTecs

This talk will explore the future of automotive functional safety, where the ever-changing landscape of advanced systems reshape traditional approaches. Electrification (EV), connectivity, driver-assistance (ADAS), and software-defined vehicles (SDV) have ushered in the era of mega-functionality and scale. This keynote presentation will illuminate the paradigm shifts and required methodologies to navigate the surge of innovation and ensure the utmost performance, reliability, and safety of automotive systems.

Gain valuable insights into the implications of a data-driven future and the transformative potential of cutting-edge advancements in artificial intelligence, machine learning, and data analytics for automotive functional safety. Discover proactive approaches that transcend reactive measures, enabling stakeholders to effectively detect anomalies, anticipate failures, and proactively mitigate risks. By embracing continuous monitoring and predictive insights, automotive manufacturers and OEMs can achieve unprecedented levels of resilience, robustness, and operational efficiency, from ICs to ECUs.

Infineon Technologies Asia-Pacific Pte Ltd, Bryan Song, Regional Marketing Manager for Green Energy Modules & System,

Imagine your e-mobility experiences is disrupted due to lack of battery power. Range anxiety becoming a new phenomenon. Hold on, this can be a thing of the past with Infineon fast DC charging solution that strategically cover the full ecosystem from AC to high power DC charging. Find out how Infineon EV Charging superstore with comprehensive products and technologies perfect the solution for every power class.

Texas Instruments Inc., Errol Leon, System Engineering & Marketing Manager, EV Charging

As the number of electric vehicles (EVs) increase, there is a growing demand for more energy-efficient charging infrastructure systems that can charge vehicles faster and enable V2G features for both DC and AC charging. Electric vehicle service equipment (EVSE) must incorporate communication, safety and security, while providing an easy upgrade path in order to accommodate the future of grid integration which includes unique challenges.

Join our speaker, Errol Leon, on this 20-minute presentation as he describes how EV charging has evolved in communications to enable smart charging in both AC-charge and DC-charging system. He will also highlight subsystem solutions and reference designs to help enable quick development for these new smart charging features.



THE ORGANIZER RESERVES THE RIGHT TO MAKE CHANGES TO THE SCHEDULE OF PRESENTATIONS, FOR ANY REASON, AT ANY TIME, WITHOUT ANY PRIOR NOTICE, AND WITHOUT ANY LIABILITY.