Stephen Las Marias, Editor of EE Times Asia/India, EDN Asia

Welcome and Opening

Texas Instruments, Steven Liu, GP Product Marketing Manager

As the technology progressed, the industrial 4.0 applications evolves a lot, differentiate features with rich on-chip resource to build unique values with system cost efficiency, more MPU performance for edge compute/AI implementation, enhanced security feature to protect your privacy and IP design, scalable platform with ease-of-use SW for a full range of product design with fast time to market, learning how TI’s new generation flagship device family – AM62x to revolutionize your next generation HMI/IoT gateway design.

Arrow Electronics, Somashekhar Pattanashetti, Director of Engineering for India

In collaboration with the Software Technology Park of India (STPI), Arrow Electronics has helped a local innovative startup, RefillBot, develop a Remote Monitoring and Management (RMM) solution aimed at improving access to clean water in Indian villages. Powered by advanced sensing and IoT technologies that allow real-time, 24/7 water quality monitoring, the new RMM platform has been successfully rolled out across 100 villages in India’s Karnataka state in just four months. As an STPI incubatee, RefillBot used the Arrow/STPI IoT Open Lab’s equipment to test and verify its boards, and consulted and collaborated with Arrow on system design and the selection of cutting-edge components. Arrow engineers and technical experts provided insight and recommendations to help RefillBot bring the solution to life.

Arm, Allen Huang, Senior AIoT Solution Manager

As the nature of compute changes, the edge plays an increasingly crucial role in supporting diverse systems with a range of power and performance requirements. To deliver on service level agreements at scale for enterprises, the edge must embrace cloud-native software principles. Allen Huang, Senior AIoT Solution Manager at arm, will discuss Project Cassini, the open, collaborative, standards-based initiative that delivers a seamless cloud-native software experience for devices. Developers of IoT and infrastructure edge solutions can access the power of Cassini today with Arm SystemReady and PSA Certified silicon and development boards and OS Linux support from the Arm ecosystem.

STMicroelectronics, Robin Feng , Strategic Marketing Manager

ST’s products and solutions are powering the technology innovation in industry 4.0 revolution. In this presentation, we will discuss ST’s Factory automation solution including the industry automation system structure and the DIDO module, analog input/output and Central Processing Unit (CPU) in PLC. Also we will introduce ST’s cost-effective systems solution on robot ARM and AGV system solution for the industry automation market.

Diodes Incorporated, John Chien, Sr. FAE Manager

IoT technology has been part of our everyday lives for the past 20 years. The IoT applications that we interact with include consumer, commercial, and industrial devices. IoT devices are connected to the internet and share data. Many of our everyday objects are now equipped with IC chips to collect and send data over a network. These objects include, but are not limited to: vending machines, energy monitoring systems, and smart home devices. In order to build an IoT device from scratch, designers have to familiarize themselves with the associated electronic components and their characteristics and parameters, which are essential to a robust design. Diodes Incorporated provides comprehensive portfolios of components, many of which are essential to IoT applications. Let’s build an IoT device from scratch. The only limit is your imagination!

Infineon Technologies Asia Pacific Pte Ltd., Adrian Gan, Senior Regional Marketing Manager

Enabling the creation of new prototype ideas based on Infineon Technologies' radar and environmental sensors, the Xensiv™ connected sensor kit (CSK) is the go-to sensor platform for Internet of Things (IoT) device development. In this technology presentation, Adrian Gan, Senior Product Management Manager at Infineon Technologies, will discuss how manufacturers in the IoT space can rapidly design, develop, and manufacture products based on a development ecosystem.

**Schedule may be subject to changes without notice.**

MosChip Technologies, Venketa Simhadri, CEO & Managing Director

Today more than 20% of the world's semiconductor designers working out of India. Most global semiconductor companies have chip designers based out of India. With around 120,000 chip designers, India is already playing a major role in the global chip design part. With 4,000 engineering colleges and 1500,000 engineering students graduating every year, India will play even major role in global semiconductor design ecosystem. MosChip provides turn-key digital and mixed-signal ASICs, design services, and embedded system design solutions leveraging its RTL2Silicon expertise with an excellent track record of first time right silicon of 100+ SoC tape-outs. To enable innovation and derive value Companies needs own the IP. Semiconductor companies in India are developing the IP for innovation ecosystem to thrive. One the key IP for semiconductor chips is SerDes PHY IP. A SerDes is serializer/deserializer converts parallel data to serial data and vice-versa. MosChip has developed in house SerDes PHY IP catalyzing India’s Semiconductor IP Innovation Ecosystem. MosChip’s indigenously developed Protocol Agnostic Long Range SerDes PHY up to 16G and Short Range SerDes PHY up t 10G can be leveraged by startups, product companies to develop ASICs for various emerging applications. In addition such developed SerDes PHY IP can be leveraged by academia for research and skill development.

Smith, Claudio Chan, Managing Director, China

Sourcing for quality electronic components in recent market conditions has presented many challenges for businesses across the supply chain. Components direct from trending manufacturers are still experiencing extended lead times and delivery dates. While navigating these issues can seem tumultuous, exploring alternative sourcing options could help manufacturers maintain production balance. Quality testing and cost-savings opportunities are a couple of key ways businesses can utilize alternative sourcing channels, such as independent distributors. Keeping lines active is a top priority for manufacturers in every vertical, and those that have the proper resources and market-intelligence information for just-in-time or forecast buys will likely be the most successful. This presentation will review the current market trends in semiconductor procurement and how applying market-intelligence data and analysis can help optimize supply chain processes. We will also discuss the role independent distributors play in the supply chain sphere and present ways manufacturers can utilize their expertise for enhanced sourcing strategies.

Mouser Electronics, Daphne Tien, Vice President, Marketing & Business Development, APAC

For Mouser Electronics will talk about the current semiconductor supply chain challenges, including the "Great Chip Shortage", and provide some strategies on how to ensure the resilience of supply chains.

Chip 1 Exchange, Jacque A. Gahari, Senior Vice President at Chip1 Global Managing Director for Chip1 ASIA

The world’s supply chain is currently in a crisis. The world is still coping with COVID-19 and many other compounded global issues that help exacerbate a delicate and precarious system.

The semiconductor industry has been plagued by counterfeit parts since its inception. Manufacturing businesses, production lines and supply chains need to stay vigilant to prevent loss of capital, lead times, and most of all: business.

Fair Friend Group (FFG), Miro Lin, CEO of Machine Tool Business Group (Taichung) of Fair Friend Group(FFG)

FAIR FRIEND GROUP(FFG), established in 1979, is now the third largest machine tool group in the world. FFG owns 37 machine tool brands and 50 production bases, and constantly cooperates with worldwide leading companies. Through FFG smart manufacturing, data services platform, and machine learning engine, gradually integrated production management, maintenance management, and value-added services. Aim to provide smart machine tools, smart production lines, and smart manufacturing turn-key solutions.

**Schedule may be subject to changes without notice.**

Welcome and Opening

Stephen Las Marias, Editor of EE Times Asia/India, EDN Asia

Infineon Technologies Asia Pacific Pte Ltd. , Kenneth Lim, Senior Vice President, Head of Automotive, Asia Pacific

Infineon drives the electrification and decarbonisation of the mobility sector. And with its expertise in sensing, connecting and protecting data, Infineon enables the digitalisation of cars and provides the basis for smart traffic concepts.

Cadence Design Systems, Robert Schweiger, Director Automotive Solutions

Automation across vehicle cockpits, driver assist systems, and autonomous driving is critical for new E/E architectures, sensor architectures, and high-bandwidth in-vehicle communications. As part of the new zonal architectures to enable autonomous driving, radar, lidar, and cameras are vital sensors undergoing rapid improvements. A new class of high-performance system-on-chips (SoC) and system-in-packages (SiP) is needed to process all sensor data. Furthermore, the dramatic increase of the electronic content in vehicles drives the trends toward integrating more functionality on a chip, meeting stringent safety, reliability, and security requirements. Autonomous driving platforms targeting maximum performance running at giga-hertz frequencies must be designed and optimized for scalability, power efficiency, thermal, and EMI robustness. This talk provides an overview of automotive trends and the implications for SoC and system design for sensors and automated driving platforms.

NXP Semiconductors, Deepak Kashyap, Regional Marketing Manager, Automotive – South Asia Pacific

Two key automotive transformation areas are connected and electric vehicles (EV) which will bring opportunities for new vehicle services and efficiencies that improve user experience and increase the efficiency of EVs to extend range. NXP has brought together our technologies and expertise in both of these areas, in collaboration with Amazon Web Services (AWS), to provide a vehicle-to-cloud solution to monitor and improve EVs. In this session, we will provide insights into the implementation of the Connected EV Management System based on the NXP GoldBox based on the S32G vehicle network processor for service-oriented gateways and the GreenBox based on the S32E for propulsion domain control, HV BMS Reference Design using latest generation of ASIL D compliant ICs from NXP and how they all work together to provide value proposition for connected EVs.

Efinix Inc, YAN Ching Lun, Senior Director, Product and Solutions

Modern automobiles require extremely sophisticated, computationally intensive capabilities for such tasks as advanced driver assistance systems (ADAS), infotainment, control, networking, connectivity and security. Many of these applications involve machine vision coupled with artificial intelligence (AI), which the near sensing compute requirements are evolving rapidly with ever-increasing number of sensors, sensors fusion, AI/ML algorithms and system level partition. FPGAs are now implemented alone or together with CPUs in many automotive systems, as they provide compute acceleration, system integration flexibility, and algorithms adaptability. Efinix FPGAs deliver power, performance, and area advantages over traditional FPGA technologies, unlocking new applications and delivering rapid time to market. In this presentation, we will discuss the automotive trends and FPGA’s role in driving the technology and innovation.

Molex, Sathish. S, Manager - Sales & Marketing

Will be introducing Molex High Performance Sealed Connectors for Power Train Applications (ECU, Sensors) to endure harsh conditions; Compact Interconnect solutions for Body Electronics to save on weight & PCB real estate; Wide range of Reliable & compact Interconnect solutions & NPIs for EV Applications

Renesas Electronics Corporation, Nachiket Hardas, Senior principal Manager of Automotive New Business Creation Division and Automotive Solution Business Unit

A global leader in microcontrollers, analog, power, SoC products and integrated platforms, Renesas provides the expertise, quality, and comprehensive solutions for a broad range of Automotive applications. Renesas xEV inverter reference is a comprehensive solution including Hardware and Software that will help reduce overall development cost, expedite time to market and achieve your own cost-effective inverter solution. We will look at one of its kind Hardware IP for Motor Control and various components and discover their impact on the inverter implementation for Electric Powertrain in this session.

Infineon Technologies Asia Pacific Pte Ltd., Martin Spiteri, Senior Director, Vehicle Automation and Chassis, Automotive Regional Centre Asia Pacific.

The key trends shaping our cars of tomorrow “Electric Vehicles”, “Advanced Driver Assistance Systems” and “Comfort and Convenience Electronics” are driving the need for more and more sensors in cars. As we move away from combustion engines, new sensors technologies and products are being developed to meet the growing requirements of the electric vehicles tractive system. The continuous directive to make vehicles safer with driver assistance systems to the point of the vehicle being able to drive autonomously requires many different types of sensor technologies offering precision, redundancy and reactivity beyond human capability. Infineon is one of largest suppliers of sensor products for automotive systems building on more than 40 years of experience in developing high precision and reliable products to meet the ever increasing demands in a fast evolving market and we will share some key automotive sensor insights in this brief presentation.

**Schedule may be subject to changes without notice.**

Welcome and Opening

Stephen Las Marias, Editor of EE Times Asia/India, EDN Asia

Bluetooth SIG, Inc., Lori Lee, Director, Marketing, APAC & China

Details of LE Audio, the next generation of Bluetooth audio specifications will be delivered. Building on 20 years of innovation, LE Audio will enhance the performance of Bluetooth audio, add support for hearing aids, and introduce exciting new features that will enable the creation of new products and use cases. This year, LE Audio added Auracast™ Broadcast Audio, an innovative new Bluetooth capability with the potential to deliver life-changing audio experiences will also be introduced. With the introduction of Auracast™ Broadcast Audio, Bluetooth technology will be installed in public locations, and people will interact with audio in various public venues and environments like never before.

Rohde & Schwarz, Mahesh Basavaraju, Market Segment Manager – Wireless Communication

5G New Radio (5G NR) network rollouts are in full swing globally, with standardization advancing and the evolution of the global standard to address new market verticals such as industrial internet of things (IIoT).

While the optimization of networks and early 5G devices is an ongoing process, lets discuss some of those technological advancements leading to 5G advanced and beyond. Rohde & Schwarz is working with partners and customers readily providing end to end solutions to address those upcoming challenges.

Silicon Labs, Desmond Chan, Senior Business Marketing Manager

Large-scale smart city, utilities, and industrial IoT applications rely on dense, low-power wireless outdoor networks. Silicon Labs supports Wi-SUN as the ideal technology for scalable and flexible implementation for smart city and metering applications, and is driving Wi-SUN deployments for electric vehicle (EV) charging, smart solar photovoltaic (PV) systems, and battery storage applications. As a result, millions of endpoints are being connected across large-scale, long-range LPWAN networks while helping utilities, city planners, and consumers manage their carbon footprint.

Nordic Semiconductor, Wendell Boyd, Director of Sales, Asean and ANZ

Emerging Long Range technology standards such as LTE-M and NB-IOT are both delivering new features and applications to developers. Together with the new standards such as 5G Non-Terrestrial Networks (NTN) and DECT NR+, they will bring even more possibilities to the industry. Furthermore, combining these with existing Short Range standards such as Bluetooth Low Energy and Wi-Fi, along with a flexible, truly ultra-low power platform, will allow for the development of more sustainable and efficient “Things” for the IoT world.

Join this webinar and explore how Nordic is providing such solutions to clients today and beyond.

Texas Instruments, James Murdock, Product Marketing Engineer LPCS

Industry 4.0 applications require ever greater levels of automation, monitoring, and control, both enabled by low-power long-battery-life wireless connectivity. Texas Instruments’ latest Bluetooth® Low Energy devices called the CC2340R5 and CC2340R2 will enable the next generation of Industrial and Factory automation and control by making it possible to easily and affordably proliferate wireless connectivity throughout an industrial setting. With industry leading low power consumption, factory deployments can operate over multiple years without the need for expensive battery replacements. Support up to 125 C also enables wireless deployment in even the most challenging of environments. Advanced software features are also enabled through a large flash footprint, and long ranges are provided by high output power. CC2340R5 and CC2340R2 will be ideal devices for companies looking to add a greater level of control, monitoring, or automation to their factories and facilities.

STMicroelectronics, Bonny Zhang, Product Marketing Manager, Memory & NFC

Bonny Zhang, Product Marketing Manager, Memory & NFC, at STMicroelectronics will discuss near-field communications (NFC) technology for network commissioning, ultra-low power IoT asset tracking, and wireless technologies for factory automation.

**Schedule may be subject to changes without notice.**